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Philips TDA7056A Datasheet

Philips TDA7056A Manual Online:

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Philips TDA7056A User Manual
Philips TDA7056A User Guide
Philips TDA7056A Online Manual

Text of Philips TDA7056A User Guide:

  • Philips TDA7056A, July 1994 2 Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A FEATURES • DC volume control • Few external components • Mute mode • Thermal protection • Short-circuit proof • No switch-on and off clicks • Good overall stability • Low power consumption • Low HF radiation • ESD protected on all pins. GENERAL DESCRIPTION The TDA7056A is a mono BTL output amplifier with DC volume control. It is designed for use in TV and monitors, but also suitable for battery-fed port

  • July 1994 3 Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A Fig.1 Block diagram. handbook, full pagewidth positive input 7 MGA072 - 1 2 3 TDA7056A V P 5 6I + i 8 I – i TEMPERATURE PROTECTION 4 signal ground DC volume control 1 n.c. positive output negative output power ground V ref STABILIZER 9 n.c. PINNING SYMBOL

  • Philips TDA7056A, July 1994 4 Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A FUNCTIONAL DESCRIPTION The TDA7056A is a mono BTL output amplifier with DC volume control, designed for use in TV and monitor but also suitable for battery-fed portable recorders and radios. In conventional DC volume circuits the control or input stage is AC coupled to the output stage via external capacitor to keep the offset voltage low. In the TDA7056A the DC volume stage is integrated into the input stage so that coupling capacitors are not required and a low offset voltage is maintained. At

  • Philips TDA7056A, July 1994 5 Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A CHARACTERISTICS V P = 12 V; f = 1 kHz; R L = 16 Ω; T amb = 25 °C; unless otherwise specified (see Fig.6) Notes to the characteristics 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by R L . 2. The noise output voltage (RMS value) at f = 500 kHz is measured with R S = 0 Ω and bandwidth = 5 kHz. 3. The ripple rejection is measu

  • July 1994 6 Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A Fig.3 Gain as a function of DC volume control. handbook, halfpage MGA075 40 – 80 20 – 20 – 40 0 0 1.2 2.00.4 1.60.8 V (V) 5 gain (dB) – 60 Fig.4 Noise output voltage as a function of DC volume control. handbook, halfpage 1000 0 800 400 20

  • Philips TDA7056A, July 1994 7 Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A APPLICATION INFORMATION Fig.6 Test and application diagram. (1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 2. handbook, full pagewidth positive input 5 kΩ 0.47 µF R S 7 MGA073 - 1 100 nF 220 µF 2 3 TDA7056A R = 16 Ω L V P (1) 5 6 I + i 8I – i V ref STABILIZER TEMPERATURE PROTECTION 4 ground DC volume control 1 n.c. 9 n.c. Fig.7 Application using a potentiometer for volume control; G v = 30 dB. handbook, halfpa

  • Philips TDA7056A, July 1994 8 Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A PACKAGE OUTLINE UNIT A A max. 2 A 3 b 1 D 1 b 2 bcD (1) E (1) Z max. (1) eLPP 1 q 1 q 2 q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 18.5 17.8 3.7 8.7 8.0 A 4 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1.0 5.9 5.7 4.4 4.2 3.9 3.4 15.1 14.9 Q 1.75 1.55 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of

  • Philips TDA7056A, July 1994 9 Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order

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